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Sheng Liu

LED Packaging for Lighting Applications

Design, Manufacturing, and Testing

€ 146.95

Helps practitioners significantly shorten the time for design, manufacturing, and testing of LED packaging

In LED Packaging and Applications, Liu and Luo introduce key LED packaging technologies: optical design, mechanical and thermal management, and reliability issues, along with introductions of several practical applications.


Taal / Language : English

Inhoudsopgave:
Foreword by Magnus George Craford.

Foreword by C. P. Wong.

Foreword by B. J. Lee.

Preface.

Acknowledgments.

About the Authors.

1 Introduction.

1.1 Historical Evolution of Lighting Technology.

1.2 Development of LEDs.

1.3 Basic Physics of LEDs.

1.3.1 Materials.

1.3.2 Electrical and Optical Properties.

1.3.3 Mechanical and Thermal Properties.

1.4 Industrial Chain of LED.

1.4.1 LED Upstream Industry.

1.4.2 LED Midstream Industry.

1.4.3 LED Downstream Industry.

1.5 Summary.

References.

2 Fundamentals and Development Trends of High Power LED Packaging.

2.1 Brief Introduction to Electronic Packaging.

2.1.1 About Electronic Packaging and Its Evolution.

2.1.2 Wafer Level Packaging, More than Moore, and SiP.

2.2 LED Chips.

2.2.1 Current Spreading Efficiency.

2.2.2 Internal Quantum Efficiency.

2.2.3 High Light Extraction Efficiency.

2.3 Types and Functions of LED Packaging.

2.3.1 Low Power LED Packaging.

2.3.2 High Power LED Packaging.

2.4 Key Factors and System Design of High Power LED Packaging.

2.5 Development Trends and Roadmap.

2.5.1 Technology Needs.

2.5.2 Packaging Types.

2.6 Summary.

References.

3 Optical Design of High Power LED Packaging Module.

3.1 Properties of LED Light.

3.1.1 Light Frequency and Wavelength.

3.1.2 Spectral Distribution.

3.1.3 Flux of Light.

3.1.4 Lumen Efficiency.

3.1.5 Luminous Intensity, Illuminance and Luminance.

3.1.6 Color Temperature, Correlated Color Temperature and Color Rendering Index.

3.1.7 White Light LED.

3.2 Key Components and Packaging Processes for Optical Design.

3.2.1 Chip Types and Bonding Process.

3.2.2 Phosphor Materials and Phosphor Coating Processes.

3.2.3 Lens and Molding Process.

3.3 Light Extraction.

3.4 Optical Modeling and Simulation.

3.4.1 Chip Modeling.

3.4.2 Phosphor Modeling.

3.5 Phosphor for White LED Packaging.

3.5.1 Phosphor Location for White LED Packaging.

3.5.2 Phosphor Thickness and Concentration for White LED Packaging.

3.5.3 Phosphor for Spatial Color Distribution.

3.6 Collaborative Design.

3.6.1 Co-design of Surface Micro-Structures of LED.

Chips and Packages.

3.6.2 Application Specific LED Packages.

3.7 Summary.

References.

4 Thermal Management of High Power LED Packaging Module.

4.1 Basic Concepts of Heat Transfer.

4.1.1 Conduction Heat Transfer.

4.1.2 Convection Heat Transfer.

4.1.3 Thermal Radiation.

4.1.4 Thermal Resistance.

4.2 Thermal Resistance Analysis of Typical LED Packaging.

4.3 Various LED Packages for Decreasing Thermal Resistance.

4.3.1 Development of LED Packaging.

4.3.2 Thermal Resistance Decrease for LED Packaging.

4.3.3 SiP/COB LED Chip Packaging Process.

4.4 Summary.

References.

5 Reliability Engineering of High Power LED Packaging.

5.1 Concept of Design for Reliability (DfR) and Reliability Engineering.

5.1.1 Fundamentals of Reliability.

5.1.2 Life Distribution.

5.1.3 Accelerated Models.

5.1.4 Applied Mechanics.

5.2 High Power LED Packaging Reliability Test.

5.2.1 Traditional Testing Standards, Methods, and Evaluation.

5.2.2 Methods for Failure Mechanism Analysis.

5.2.3 Failure Mechanisms Analysis.

5.3 Rapid Reliability Evaluation.

5.3.1 Material Property Database.

5.3.2 Numerical Modeling and Simulation.

5.4 Summary.

References.

6 Design of LED Packaging Applications.

6.1 Optical Design.

6.1.1 Introduction of Light Control.

6.1.2 Reflectors.

6.1.3 Lenses.

6.1.4 Diffuser.

6.1.5 Color Design and Control in LED Applications.

6.2 Thermal Management.

6.2.1 Analysis of System Thermal Resistance.

6.2.2 Types of Heat Dissipation to Environment.

6.2.3 Design and Optimization of Fin Heat Sink.

6.2.4 Design Examples of Thermal Management of Typical LED Lighting Systems.

6.3 Drive Circuit and Intelligent Control Design.

6.3.1 Typical LED Wireless Intelligent Control System.

6.3.2 Working Principles of Wireless Intelligent Control System.

6.4 Summary.

References.

7 LED Measurement and Standards.

7.1 Review of Measurement for LED Light Source.

7.2 Luminous Flux and Radiant Flux.

7.3 Measurement for Luminous Intensity.

7.4 LED Chromaticity Coordinate.

7.5 Dominant Wavelength Determination Algorithm.

7.5.1 Curve Fitting Method.

7.6 LED Color Purity.

7.7 Color Temperature and Correlated Color Temperature of Light Source.

7.8 Automatic Sorting for LEDs.

7.9 Measurement for LED Road Lights.

7.9.1 Electrical Characteristics.

7.9.2 Color Characteristics.

7.9.3 Light Distribution Characteristics.

7.9.4 Dynamic Characteristics.

7.9.5 Test of Reliability.

7.10 Summary.

References.

Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance.

Index.
Extra informatie: 
Hardback
376 pagina's
Januari 2011
794 gram
253 x 175 x 25 mm
Wiley-Blackwell us

Levertijd: 5 tot 11 werkdagen