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Richard K. Ulrich

Advanced Electronic Packaging

€ 223.95

This updated edition of the widely adopted industry classic Advanced Electronic Packaging, Second Edition now features a new focus on the current practices in electron


Taal / Language : English

Inhoudsopgave:
Chapter 1: Introduction and overview of microelectronic packaging.

Chapter 2: Materials for microelectronic packaging.

Chapter 3: Processing technologies.

Chapter 4: Organic printed circuit board materials and processes.

Chapter 5: Ceramic substrates.

Chapter 6: Electrical considerations, modeling, and simulation.

Chapter 7: Thermal considerations.

Chapter 8: Mechanical design considerations.

Chapter 9: Discrete and embedded passive devices.

Chapter 10: Electronic package assembly.

Chapter 11: Design considerations.

Chapter 12: Radio frequency and microwave packaging.

Chapter 13: Power electronics packaging.

Chapter 14: Multichip and three dimensional packaging.

Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study.

Chapter 16: Reliability considerations.

Chapter 17: Cost evaluation and analysis.

Chapter 18: Analytical techniques for materials characterization.
Extra informatie: 
Hardback
840 pagina's
Januari 2006
1542 gram
260 x 184 x 44 mm
Wiley-Blackwell us

Levertijd: 5 tot 11 werkdagen